The **ATS-17G-40-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling Integrated Circuits (ICs) and other electronic packages. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 14.56°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Pattern** | Straight Fin | --- ## 2. Key Electronic Components ### A. The Heat Sink Body The main body is made of **Aluminum 6063**, which is preferred in electronics for its high thermal conductivity and lightweight properties. The "Straight Fin" design allows for efficient airflow across the surface, dissipating heat from the semiconductor device to the ambient air. ### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-17G-40-C2-R0** uses a mechanical push-pin system. This provides: * **Constant Pressure:** Ensures maximum contact between the heat sink base and the electronic component. * **Reliability:** Mechanical mounting is more durable than thermal tape in high-vibration environments. * **Reusability:** Can be easily removed or replaced during PCB maintenance. ### C. Thermal Interface Material (TIM) Typically, these parts come with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This fills the microscopic air gaps between the heat sink and the chip (e.g., CPU, FPGA, or GPU), significantly reducing thermal resistance. --- ## 3. Performance Analysis The efficiency of this part is highly dependent on the velocity of the air (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 14.56 | | 300 (Moderate) | 6.50 | | 500 (High) | 4.40 | --- ## 4. Typical Applications * **Networking Gear:** Switches and Routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or MOSFETs. * **Computing:** Secondary cooling for chipsets or memory controllers.