The **ATS-17G-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The part belongs to the **pushPIN™** series, which focuses on easy installation and high thermal efficiency. | Parameter | Specification | | :--- | :--- | | **Base Part Number** | ATS-17G-52-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 10.79°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Key Components and Design Features * **Heat Sink Body:** Constructed from high-grade aluminum for optimal thermal conductivity. The "Cross-Cut" fin design increases surface area, allowing air to flow in multiple directions, which is ideal for systems with inconsistent airflow. * **pushPIN™ Attachment:** This model uses a plastic or brass pin with a stainless steel spring. This provides a precise "pre-loaded" pressure to ensure the heat sink makes firm contact with the electronic component. * **C2 Material/Finish:** The "C2" suffix indicates that the heat sink is finished with a **Blue Anodized** coating. This not only prevents corrosion but also slightly increases thermal emissivity. * **Thermal Interface Material (TIM):** This specific part number usually comes with **T766** pre-applied. This is the "thermal paste" or pad on the bottom that fills microscopic air gaps between the component and the heat sink. --- ### 3. Usage Context In a circuit design, this part is used for: 1. **Heat Dissipation:** Preventing thermal throttling in integrated circuits. 2. **Mechanical Stability:** The push-pin system provides a more secure mechanical bond than simple adhesive tapes. 3. **Space Efficiency:** With a 35mm footprint and 25mm height, it is designed for medium-profile enclosures where vertical space is available but PCB real estate is limited. --- ### 4. Comparison: Ducted vs. Unducted Flow Thermal performance varies significantly based on the airflow environment within the electronic chassis: | Airflow Velocity (LFM) | Unducted Resistance (°C/W) | Ducted Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 10.79 | 3.64 | | 300 | 4.72 | 2.35 | | 500 | 3.35 | 1.88 |