The **ATS-17G-64-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed for cooling electronic components such as CPUs, GPUs, or high-power FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Product Type** | Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Fin Style** | Straight Fin | --- ### 2. Physical Design & Construction * **Heat Sink Material:** Constructed from high-quality aluminum for optimal weight-to-thermal conductivity ratio. * **Anodization:** The blue anodized coating prevents oxidation and enhances emissivity, improving heat radiation. * **Fin Geometry:** It features a "straight-fin" design. This is ideal for applications where there is a consistent, directed airflow (forced convection) from a nearby fan. * **Thermal Interface Material (TIM):** This model comes pre-applied with **T766**, a phase-change or high-conductivity material that fills microscopic air gaps between the component and the heat sink. --- ### 3. Mounting Mechanism (Push-Pin) The "Push-Pin" system is a mechanical attachment method used to secure the heat sink to a PCB. 1. **Spring-Loaded Pins:** These provide consistent pressure across the surface of the component, ensuring high thermal contact. 2. **Stability:** Unlike adhesive tapes, push-pins offer a more permanent and vibration-resistant connection. 3. **Ease of Assembly:** They are designed for quick installation in manufacturing environments through pre-drilled holes in the PCB. --- ### 4. Thermal Performance Thermal resistance is measured in °C/W (Degrees Celsius per Watt). For the ATS-17G-64-C2-R0, performance varies based on airflow: * **Low Airflow (200 LFM):** Higher thermal resistance. * **High Airflow (500+ LFM):** Significant drop in thermal resistance, allowing for higher power dissipation. --- ### 5. Part Number Breakdown ```text ATS - 17G - 64 - C2 - R0 | | | | | | | | | +-- Revision Code | | | +------- Color/Finish (Blue Anodized) | | +------------ Fin Design/Internal Code | +------------------ Series Designation +------------------------ Manufacturer (Advanced Thermal Solutions) ```