The **ATS-17G-67-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17G-67-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.03°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Prefix for Advanced Thermal Solutions. * **17G:** Product series (typically referring to specific fin geometry and spacing). * **67:** Specific dimension code for the 45x45mm footprint. * **C2:** Refers to the material and finish (Aluminum with Blue Anodization). * **R0:** Revision code or packaging indicator. --- ### 3. Key Features and Applications #### Thermal Performance The "Straight Fin" design is optimized for **forced air cooling** environments. The 2.03°C/W thermal resistance indicates that for every watt of power the component dissipates, the temperature will rise approximately 2.03 degrees Celsius above the ambient air temperature (assuming a 200 LFM airflow). #### Mounting Mechanism The **Push-Pin** system is a reliable mechanical attachment method. It consists of: 1. **Plastic Pins:** Inserted through pre-drilled holes in the PCB. 2. **Compression Springs:** Provide consistent downward pressure to ensure maximum contact between the heatsink and the component. #### Interface Material (TIM) The unit comes with **T766** pre-applied. This is a "phase change" or high-performance thermal pad that eliminates the need for manual application of thermal grease, reducing assembly time and ensuring a uniform thermal path. --- ### 4. Common Use Cases * **Networking Equipment:** Routers, switches, and high-speed modems. * **Industrial PCs:** Embedded systems requiring passive or active cooling. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.