ATS-17G-71-C2-R0
AI

The **ATS-17G-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs).
### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-17G-71-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight Fin |
| **Thermal Resistance** | 6.69°C/W (at 100 LFM) |
| **Attachment Method** | Push-Pin (Brass) |
| **Interface Material** | T766 (Thermal Tape) |
---
### Physical Dimensions
Precise physical layout is critical for ensuring the part fits within the component "keep-out" zones on a motherboard or embedded system.
* **Length (A):** 45.00 mm
* **Width (B):** 45.00 mm
* **Height (C):** 30.00 mm
* **Pitch (E):** 38.00 mm (Distance between mounting holes)
### Component Features & Functions
1. **Thermal Performance:** The straight fin design is optimized for high-airflow environments. The heat sink draws heat away from active components (like CPUs, FPGAs, or MOSFETs) and dissipates it into the surrounding air.
2. **Push-Pin Mounting:** This specific model uses a brass push-pin mechanism. This provides a constant, reliable pressure between the heat sink and the electronic component, which improves thermal transfer and prevents the sink from shifting during vibration.
3. **T766 Thermal Interface Material (TIM):** The part comes pre-applied with a thermal pad or tape. This fills microscopic air gaps between the component surface and the heat sink, significantly lowering thermal resistance.
4. **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases surface emissivity and provides a layer of electrical insulation and corrosion resistance.
---
### Integration Example
When integrating this into a PCB design, the following mounting hole configuration is typically required in your EDA software (Altium, KiCad, etc.):
```text
// Typical PCB Footprint Note
Hole Diameter: 3.0mm
Pitch: 38.00mm (Center-to-Center)
Clearance: 45mm x 45mm (Heatsink Footprint)
```
- ⤷
What are the airflow requirements to achieve the maximum thermal efficiency for this part?
- ⤷ How does the T766 interface material compare to high-performance thermal paste?
- ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?