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  • ATS-17G-71-C2-R0

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    The **ATS-17G-71-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions directly to Printed Circuit Boards (PCBs). ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-17G-71-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Interface Material** | T766 (Thermal Tape) | --- ### Physical Dimensions Precise physical layout is critical for ensuring the part fits within the component "keep-out" zones on a motherboard or embedded system. * **Length (A):** 45.00 mm * **Width (B):** 45.00 mm * **Height (C):** 30.00 mm * **Pitch (E):** 38.00 mm (Distance between mounting holes) ### Component Features & Functions 1. **Thermal Performance:** The straight fin design is optimized for high-airflow environments. The heat sink draws heat away from active components (like CPUs, FPGAs, or MOSFETs) and dissipates it into the surrounding air. 2. **Push-Pin Mounting:** This specific model uses a brass push-pin mechanism. This provides a constant, reliable pressure between the heat sink and the electronic component, which improves thermal transfer and prevents the sink from shifting during vibration. 3. **T766 Thermal Interface Material (TIM):** The part comes pre-applied with a thermal pad or tape. This fills microscopic air gaps between the component surface and the heat sink, significantly lowering thermal resistance. 4. **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases surface emissivity and provides a layer of electrical insulation and corrosion resistance. --- ### Integration Example When integrating this into a PCB design, the following mounting hole configuration is typically required in your EDA software (Altium, KiCad, etc.): ```text // Typical PCB Footprint Note Hole Diameter: 3.0mm Pitch: 38.00mm (Center-to-Center) Clearance: 45mm x 45mm (Heatsink Footprint) ```
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve the maximum thermal efficiency for this part?
    • ⤷ How does the T766 interface material compare to high-performance thermal paste?
    • ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?