The **ATS-17G-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The model number provides specific details about the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance** | 1.97 °C/W (at 200 LFM) | | **Thermal Interface (TIM)** | T412 (Pre-applied) | --- ### 2. Physical Design Features * **Fin Profile (Straight Fin):** This model typically features a straight-fin design, which is optimized for high-velocity airflow environments (active cooling). * **Push-Pin Attachment:** Instead of messy adhesives, this part uses a mechanical push-pin mechanism. This ensures consistent pressure across the component surface, which improves heat transfer and allows for easier maintenance. * **T412 Interface Material:** The "R0" suffix indicates that it comes with a high-conductivity thermal interface material already applied to the base, ensuring a low-resistance path between the chip and the heat sink. --- ### 3. Core Electronic Role In a circuit, the **ATS-17G-75-C3-R0** acts as a **passive cooling element**. Its primary roles include: 1. **Thermal Dissipation:** It increases the surface area of the component it is attached to, allowing heat to be transferred more efficiently to the surrounding air. 2. **Junction Temperature Regulation:** By maintaining a low $T_j$ (Junction Temperature), it prevents thermal throttling and extends the operational lifespan of the semiconductor. 3. **Reliability:** In high-power applications (like 5G infrastructure or industrial controllers), this part prevents "hot spots" that could lead to catastrophic board failure. --- ### 4. Mounting Schematic Example To integrate this into a PCB design, the following hole pattern is generally required: ```markdown PCB Layout Requirements: - Pitch: ~38.00mm (Distance between push-pin holes) - Hole Diameter: 3.0mm - Component Clearance: 45mm x 45mm square ```