The part number **ATS-17G-79-C2-R0** refers to a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The table below breaks down the physical and thermal properties of the device: | Property | Value / Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.63 °C/W (@ 200 LFM) | | **Flow Orientation** | Vertical or Horizontal (Fin Dependent) | | **Spring Type** | Compression Spring | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **17G**: Series/Designator for the attachment system. - **79**: Specific model size/configuration (30x30mm). - **C2**: Thermal Interface Material (TIM) type (typically T766 or similar). - **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical part, its role in an electronic circuit is critical for the following reasons: 1. **Thermal Management**: It dissipates heat generated by semiconductor junctions. Without it, the component would reach its "Maximum Operating Junction Temperature" ($T_j$), leading to thermal throttling or permanent failure. 2. **ESD Protection**: The blue anodized coating provides a level of electrical insulation, preventing accidental shorts if a tool touches the sink. 3. **Mechanical Stability**: The push-pin mechanism provides specific downward pressure (clamping force), ensuring the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the sink for maximum efficiency. --- ### 4. Application Use-Case This specific part is often found on: * Networking switches and routers. * Industrial embedded PCs. * Voltage Regulator Modules (VRMs) that require high airflow cooling. ---