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  • ATS-17G-80-C2-R0

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    The **ATS-17G-80-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" heat sink series designed for high-performance cooling of integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Type** | Heat Sink | | **Material** | Aluminum | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 1.90°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Fin Style** | Blue Anodized, Straight Fin | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer. #### B. The Attachment Mechanism (Push Pins) Unlike adhesive-only heat sinks, the `-R0` series uses a mechanical **Push Pin** system: * **Brass Pins:** Provide a durable, reusable mechanical connection to the PCB. * **Compression Springs:** These ensure a consistent, high-pressure contact between the heat sink base and the electronic chip, which is critical for minimizing thermal resistance. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 thermal tape**. This ensures that microscopic air gaps between the processor and the heat sink are filled, allowing heat to flow efficiently from the silicon to the aluminum fins. --- ### 3. Part Number Decoder Understanding the naming convention helps in identifying the specific configuration: | Prefix | Size/Series | Height | Material/Finish | Attachment | | :--- | :--- | :--- | :--- | :--- | | **ATS** | **17G** | **80** | **C2** | **R0** | | Advanced Thermal Solutions | 30mm x 30mm footprint | 15mm Profile | Blue Anodized Aluminum | Standard Push Pin Kit | --- ### 4. Typical Applications * **Networking Hardware:** Switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **BGA Components:** High-speed processors that require active or passive airflow.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the ATS push pin system?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Is there a version of this heat sink with a higher fin profile for better performance?