The **ATS-17G-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "maxiFLOW" product line, designed to optimize airflow and heat dissipation for electronic components. --- ## Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 20.00mm | | **Thermal Resistance** | 2.02°C/W @ 200 LFM | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Flow Pattern** | maxiFLOW (Directional) | --- ## Key Features ### 1. maxiFLOW™ Design The fins on this heat sink are spread out in a specific pattern to increase the surface area and minimize pressure drop. This design is highly efficient for forced-air cooling environments (systems with fans). ### 2. Push-Pin Attachment The `-R0` suffix indicates a standard push-pin mounting system. This provides: * **Reliability:** Consistent pressure across the component for better heat transfer. * **Ease of Assembly:** Quick installation into pre-drilled holes on a PCB (Printed Circuit Board). * **Vibration Resistance:** Secure attachment suitable for industrial or mobile applications. ### 3. Integrated TIM (Thermal Interface Material) The unit comes with **T766** phase-change material pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures a low-resistance path from the chip to the aluminum fins. ### 4. Blue Anodized Finish The anodization provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. --- ## Common Applications This specific part is typically used for cooling mid-to-high power electronic integrated circuits (ICs), such as: * **FPGAs** (Field Programmable Gate Arrays) * **ASICs** (Application Specific Integrated Circuits) * **Processors/CPUs** in embedded systems * **Telecommunications** and networking hardware