The **ATS-17G-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for secure attachment to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the core technical characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 10.00mm | | **Thermal Resistance** | 23.98°C/W (at 200 LFM) | | **Fin Style** | XCUT (Cross-cut) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Design Features * **XCUT Fin Pattern:** The fins are designed with a cross-cut pattern. This allows for multi-directional airflow, making it highly effective in compact electronic enclosures where airflow may not be strictly linear. * **Push Pin Mounting:** Unlike adhesive-only heat sinks, this part uses a mechanical push-pin system with a built-in spring. This provides consistent pressure across the component (CPU, GPU, or ASIC), ensuring optimal thermal transfer and mechanical stability during vibration. * **Blue Anodized Finish:** The anodized coating is not just for aesthetics; it increases surface emissivity and provides a level of electrical insulation and corrosion resistance. * **Pre-applied TIM:** It comes with a pre-applied Thermal Interface Material (T766), which simplifies the assembly process in mass production. --- ### 3. Applications This specific part is generally used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network processors and switches. 2. **Embedded Systems:** Ideal for ARM-based processors or FPGAs that generate moderate heat in small form factors. 3. **Power Electronics:** Dissipating heat from high-current voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Overview Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | **Unducted (Natural)** | 0.0 | ~24.0 | | **200 LFM** | 1.0 | 12.0 | | **400 LFM** | 2.0 | 8.5 |