The **ATS-17G-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 21.97° C/W (Natural) / 1.02° C/W (@ 500 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 10.00mm | | **Fin Style** | Straight (Fine Pitch) | | **Spring/Pin Type** | Brass Pin / Steel Spring | --- ### 2. Key Components and Design #### A. The pushPIN™ Attachment System This part features a specialized mounting mechanism called **pushPIN™**. * **Application:** It allows for quick and secure attachment to the PCB (Printed Circuit Board) using pre-drilled holes. * **Compression:** The built-in springs ensure consistent pressure between the heat sink and the component, optimizing thermal transfer. #### B. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the part comes with a pre-applied **Thermal Interface Material**. * This material fills microscopic air gaps between the component surface and the heat sink base to maximize heat conduction. #### C. Fin Geometry * The **straight-fin design** is optimized for "forced air" cooling (airflow from a fan). * The low profile (10mm height) makes it ideal for dense electronic enclosures or 1U/2U server blades where vertical space is limited. --- ### 3. Usage Context This part is typically found in: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial computers where reliability is critical. 3. **Power Electronics:** Managing heat in voltage regulators and power modules.