## Technical Overview: ATS-17H-07-C2-R0 The **ATS-17H-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance (Flowing)** | 17.09 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 3.32 °C/W | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Component Design & Construction The design of the ATS-17H-07-C2-R0 focuses on maximizing surface area while maintaining a compact footprint. #### A. Fin Geometry * **Type:** Cross-cut (Pin Fin) design. * **Advantage:** Allows for multidirectional airflow, making it ideal for systems where the air direction might change or is not perfectly linear. #### B. Mounting Mechanism (pushPIN™) This part utilizes a specific mechanical attachment system: 1. **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** Provides precise, uniform pressure across the interface to ensure maximum contact with the electronic component. 3. **TIM (Thermal Interface Material):** Usually comes with pre-applied T766 phase-change material or similar to bridge the microscopic gaps between the chip and the aluminum base. --- ### 3. Thermal Performance Analysis The efficiency of this part is measured by its **Thermal Resistance**. A lower number indicates better heat dissipation. * **Low Airflow (100 LFM):** 17.09 °C/W. * **High Airflow (700 LFM):** 2.22 °C/W. * **Result:** This part is highly dependent on active cooling (fans). The efficiency increases nearly 8-fold when moving from stagnant air to high-velocity airflow. --- ### 4. Dimensional Data | Dimension | Value | | :--- | :--- | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height** | 12.70 mm | | **Pitch** | 38.00 mm (Hole to Hole) | --- ### 5. Application Use-Cases * **Embedded Systems:** Used on SoCs (System on Chips) in industrial computers. * **Telecommunications:** Cooling for high-speed networking ASICs. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules) or MOSFETs.