The **ATS-17H-41-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **BlueIce™** series of high-performance heat sinks designed for electronic cooling applications. Below is a detailed breakdown of its specifications and electronic application. --- ### 1. General Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-17H-41-C2-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | --- ### 2. Thermal and Physical Properties This component is engineered to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. * **Design (Fin Type):** It features a **Straight Fin** design, which is optimized for high-speed airflow environments. * **Dimensions:** * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 22.86 mm * **Thermal Resistance:** This indicates how efficiently the part transfers heat. * *Note: Specific °C/W values depend on the Airflow (LFM) in the system.* --- ### 3. Mounting and Interface The "R0" designation usually refers to the specific revision or the type of **Thermal Interface Material (TIM)** pre-applied to the base. 1. **pushPIN™ Attachment:** The part uses a specialized pin and spring mechanism. This ensures constant pressure (load) on the electronic chip, which improves thermal transfer and prevents the heat sink from shifting during vibration. 2. **Spring Type:** Usually features a brass or steel spring for durability. 3. **TIM (Thermal Interface Material):** Often comes with a pre-applied phase-change material or high-performance thermal grease to eliminate air gaps between the chip and the aluminum base. --- ### 4. Typical Applications The ATS-17H-41-C2-R0 is commonly used in: * **Telecommunications:** Cooling for high-speed routers and switches. * **Embedded Systems:** Industrial PCs where active cooling (fans) might be limited. * **Power Electronics:** Dissipating heat from large MOSFET arrays or voltage regulators. ---