The **ATS-17H-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin attachment series designed for cooling electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Specification | Details | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Heat Sink Type** | XCUT (Cross-cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Fin Height)** | 25mm | | **Thermal Resistance** | 7.29 °C/W (at 100 LFM) | --- ### 2. Key Features and Components #### A. The XCUT Fin Pattern This heat sink features a **cross-cut** design. Unlike standard straight-fin heat sinks, the cross-cut pattern allows for "omni-directional" airflow. This means it can effectively dissipate heat even if the airflow from the system fan is coming from an irregular angle. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or complex brackets, this part uses a **Push-Pin and Brass Spring** mechanism: * **Ease of Install:** Clips into pre-drilled holes on the PCB. * **Consistent Pressure:** The spring ensures the heat sink is pressed firmly against the electronic chip for maximum heat transfer. * **Reliability:** It is less likely to fall off due to vibration compared to "peel-and-stick" solutions. #### C. Material and Coating * **Aluminum 6063:** Provides a balance of high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization increases the surface emissivity and protects the aluminum from corrosion. --- ### 3. Application Use Cases This specific part is typically found in: * **Networking Equipment:** Routers, switches, and gateways. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecom:** High-speed data processing units. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt):* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.29 | | 200 (1.0 m/s) | 2.35 | | 300 (1.5 m/s) | 1.49 | ---