The **ATS-17H-72-C2-R0** is a specific electronic component categorized as a **Heat Sink**, designed by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, which is engineered for high-performance cooling of electronic components like CPUs, GPUs, and other integrated circuits. --- ## 1. Core Technical Specifications The following table highlights the primary mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | 5.11°C/W @ 100 LFM (undirected) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 35.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Features and Components To understand the "electronic parts" aspect of this assembly, one must look at its design architecture: ### A. The Heat Sink Body * **Fin Design:** It features a "flared fin" pattern. This geometry increases the surface area for heat dissipation while maintaining a lower pressure drop, making it efficient for forced-air cooling systems. * **Base Plate:** The bottom is precision-machined to be flat, ensuring maximum contact with the electronic component it is cooling. ### B. The pushPIN™ Attachment System Rather than using messy adhesives or complicated brackets, this part uses a standardized **pushPIN™** system. * **Pins:** Brass or plastic pins that lock into pre-drilled holes in the Printed Circuit Board (PCB). * **Springs:** Compression springs ensure constant, uniform pressure (clamping force) between the heat sink and the chip, which is critical for consistent thermal performance. ### C. Thermal Interface Material (TIM) * **T766 Phase Change Material:** The unit comes with a pre-applied layer of T766. This material fills microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ## 3. Applications This component is typically found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where space is limited but heat generation is high. * **Power Supplies:** Regulating heat for power transistors. --- ## 4. Performance vs. Airflow The efficiency of the ATS-17H-72-C2-R0 is highly dependent on the velocity of air (measured in Linear Feet per Minute - LFM) provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.11 | | 200 (1.0 m/s) | 2.73 | | 300 (1.5 m/s) | 2.08 | | 400 (2.0 m/s) | 1.76 |