ATS-17H-89-C2-R0
AI

### Overview of ATS-17H-89-C2-R0
The **ATS-17H-89-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series, specifically designed for cooling electronic components like CPUs, GPUs, FPGAs, and ASICs where space is limited but thermal demands are high.
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### Technical Specifications
The following table outlines the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-17H-89-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 7.94°C/W (at 100 LFM / 0.5 m/s) |
| **Weight** | ~50 grams |
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### Electronic and Thermal Functionality
Although it is a mechanical part, its role in an electronic circuit is critical for **thermal management**:
1. **Thermal Dissipation:** It increases the surface area of the heat-generating component (e.g., a power transistor or processor), allowing air to carry away heat more efficiently.
2. **PushPIN™ Technology:** The part uses a specific attachment system involving a plastic or brass pin and a stainless steel spring. This ensures a precise **constant pressure** against the electronic component, which maximizes thermal interface material (TIM) performance.
3. **Straight Fin Design:** The straight fin geometry is optimized for **forced-air cooling** (fan-driven airflow). It allows air to pass through the fins with minimal pressure drop.
4. **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer provides a small degree of electrical insulation and increases the emissivity of the surface, slightly improving radiant cooling.
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### Typical Applications
* **Integrated Circuits (ICs):** Cooling high-frequency BGA packages.
* **Power Supplies:** Managing heat in voltage regulators and power converters.
* **Embedded Systems:** Used in compact industrial PCs where vertical space allows for a 30mm height.
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- ⤷
What is the significance of the thermal resistance value (7.94°C/W) in circuit design?
- ⤷ How does the pushPIN™ attachment method compare to adhesive thermal tapes?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for use with this heat sink?