The **ATS-17H-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Fin Type** | Fine Pitch (Straight Fin) | | **Dimensions** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 7.29 °C/W (Unducted Flow @ 100 LFM) | --- ## 🔍 Key Electronic Components & Features ### 1. The Fin Structure (Heat Dissipation) The "95" in the part number refers to the specific fin design. This model uses a **fine-pitch straight fin** geometry. This design increases the total surface area available for heat transfer, making it ideal for systems with high-velocity airflow (fans). ### 2. Push-Pin Attachment Mechanism Instead of messy adhesives or thermal tape, this part uses a mechanical **Push-Pin** system: * **Springs:** Provides consistent pressure (clamping force) to ensure the heat sink stays in contact with the electronic chip. * **Plastic/Brass Pins:** Securely snap into pre-drilled holes on the PCB (Printed Circuit Board). ### 3. Thermal Interface Material (TIM) The **C2** designation indicates that this heat sink typically comes with **T766** thermal phase-change material or a high-performance thermal grease pre-applied to the base. This fills microscopic air gaps between the chip and the aluminum base to improve heat conductivity. ### 4. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ## 📉 Performance Summary Thermal resistance determines how many degrees Celsius the component's temperature will rise for every watt of power it consumes. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.29 | | 300 (1.5 m/s) | 2.50 | | 500 (2.5 m/s) | 1.70 | ---