The **ATS-17H-99-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed specifically for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ### 1. Technical Specifications The following table highlights the core physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 11.52°C/W @ (Natural Convection) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Type** | XCUT (Cross-cut) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. Fin Geometry (XCUT) The "XCUT" design features a grid-like pattern of fins. Unlike straight-fin heat sinks, the cross-cut pattern allows for: * **Omnidirectional Airflow:** Air can enter or exit from multiple angles, making it ideal for enclosures with irregular airflow. * **Increased Surface Area:** More surface area contact with the air facilitates better heat dissipation. #### B. Push-Pin Attachment The model uses a spring-loaded push-pin mechanism. * **Ease of Install:** No special tools are required; the pins snap into pre-drilled holes on the PCB. * **Consistent Pressure:** The built-in springs provide a precise amount of downward force, ensuring the heat sink stays in contact with the component despite vibrations or thermal expansion. #### C. Thermal Interface Material (TIM) This part comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Benefit:** Reduces thermal resistance at the contact point, allowing heat to flow more efficiently into the aluminum. --- ### 3. Application Use Cases The ATS-17H-99-C2-R0 is typically used in the following environments: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where mechanical stability is required. 3. **Power Electronics:** Managing heat for voltage regulators or small power modules. ---