The **ATS-18A-06-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks. Below is a detailed breakdown of its specifications and electronic/mechanical properties. ### 1. General Specifications This part is a high-performance heat sink designed primarily for cooling electronic components such as CPUs, GPUs, or high-power ASICs. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18A-06-C2-R0 | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 20.27°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring no interference with surrounding surface-mount devices (SMDs). * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 25.00 mm * **Pitch (E):** 33.00 mm * **Pitch (F):** 33.00 mm --- ### 3. Thermal Performance Data The "C2" in the part number indicates the thermal interface material and performance tier. The thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 20.27 | | 300 (1.5 m/s) | 8.69 | | 500 (2.5 m/s) | 5.30 | | 700 (3.5 m/s) | 4.10 | --- ### 4. Key Electronic & Mechanical Features #### A. pushPIN™ Attachment Unlike adhesive tapes, this part uses a **pushPIN™** system. * **Benefits:** Ensures consistent pressure (clamping force) across the electronic chip, which optimizes heat transfer. * **Hardware:** Features a brass component with a stainless steel spring for durability and multiple re-attachment cycles. #### B. maxiFLOW™ Fin Design The heat sink utilizes a tapered fin design. This is engineered to: * Increase surface area for radiation and convection. * Reduce pressure drop, allowing the electronic system's fans to run more efficiently. #### C. Thermal Interface Material (TIM) The **"C2"** suffix typically indicates that the part comes pre-applied with **ATS-54** (a high-performance thermal grease) or a specific Phase Change Material, ensuring low contact resistance between the electronic package and the aluminum base. ---