The **ATS-18A-09-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and features. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ | | **Type** | Top Mount / Board Level | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Style** | Fine-Pitch (Straight Fins) | | **Thermal Resistance** | 10.58°C/W (Unducted Flow @ 100 LFM) | | **Base Dimensions** | 45.00mm x 45.00mm | | **Height** | 20.00mm | --- ### 2. Key Component Features #### A. Thermal Interface Material (TIM) The "C2" suffix indicates that this model comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application and ensures optimal heat transfer between the chip and the aluminum base. #### B. Push-Pin Mounting System Instead of using adhesive tape or heavy bolts, this part uses the **pushPIN™** system: - **Spring-loaded:** Provides consistent pressure to ensure the heatsink stays in contact with the component. - **Tool-less:** Designed for rapid assembly during the manufacturing process. #### C. Fin Design (Blue Anodized) The heatsink features a **blue anodized finish**, which serves two purposes: 1. **Corrosion Resistance:** Protects the aluminum from environmental oxidation. 2. **Thermal Radiation:** Slightly improves heat dissipation efficiency compared to raw aluminum. --- ### 3. Performance Data Thermal resistance is critical for determining if this part can cool a specific processor. | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 10.58 | 3.57 | 2.15 | --- ### 4. Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array (BGA) processors. * **Telecommunications:** Cooling of networking switches and routers. * **Industrial PCs:** Used in compact enclosures where airflow might be restricted.