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  • ATS-18A-115-C2-R0

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    The **ATS-18A-115-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the physical and thermal properties of the heat sink. | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | Part of the *pushPIN™* series | | **Base Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Protects against corrosion and improves radiation | | **Thermal Resistance** | 5.33 °C/W (undirected flow) | Measurement at 100 LFM (linear feet per minute) | | **Dimensions** | 40mm x 40mm x 20mm | Standard square footprint | | **Attachment Type** | pushPIN™ | Uses a spring-loaded pin for secure mounting | | **Thermal Interface** | T766 | Pre-applied thermal phase-change material | --- ### 2. Component Design Features * **Fin Profile:** This model typically uses a **cross-cut** or **straight fin** design. The "C2" in the part number indicates a specific fin pattern designed to maximize surface area for heat dissipation in airflow-constrained environments. * **The pushPIN™ System:** Unlike adhesive-based heat sinks, this part uses a mechanical attachment system. It consists of a brass or plastic pin and a stainless steel spring that applies consistent pressure to the component, ensuring optimal contact with the heat source. * **Material Efficiency:** The 6063 aluminum alloy provides a balance between thermal performance and structural rigidity. --- ### 3. Part Number Breakdown (Nomenclature) To understand variations of this part, here is how the code is structured: 1. **ATS-18A:** Identifies the specific product series and family. 2. **115:** Represents the physical dimensions and fin configuration. 3. **C2:** Refers to the thermal performance category and fin density. 4. **R0:** Indicates the revision and that the product is RoHS (Restriction of Hazardous Substances) compliant. --- ### 4. Integration Considerations When incorporating this part into a PCB design, consider the following: * **Hole Pattern:** The PCB must have pre-drilled holes to accommodate the pushPIN™ spacing (usually specific to the 40mm frame). * **Airflow Direction:** Performance is significantly enhanced when placed in the path of a system fan. * **Height Clearance:** Ensure the 20mm height does not interfere with neighboring components or the chassis lid.
    ✨ Follow-up Questions
    • ⤷ What is the exact hole-to-hole spacing required on a PCB for this pushPIN heat sink?
    • ⤷ How does the thermal resistance change at higher airflow velocities (e.g.
    • ⤷ 500 LFM)?
    • ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?