The **ATS-18A-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of their "push pin" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-18A-116-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimension (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Thermal Resistance** | 4.14°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | XC-Cut (Cross-cut) | --- ### Key Electronic Components & Design Features #### 1. Heat Sink Geometry (XC-Cut) The "XC-Cut" refers to the straight-fin design that has been cross-cut into a pin-fin-like pattern. In electronics cooling, this is critical because: * **Omnidirectional Airflow:** It allows air to enter the fin structure from any direction, making it ideal for systems where the fan orientation might change. * **Surface Area:** It maximizes the surface-area-to-volume ratio, increasing the rate of heat dissipation. #### 2. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just aesthetic. Anodizing increases **emissivity**, which improves the heat sink's ability to radiate heat into the environment and protects the aluminum from corrosion. #### 3. Attachment Mechanism (Push Pin & Spring) The "R0" suffix often denotes the specific mounting hardware. This model uses a **push-pin** system with a brass or plastic pin and a compression spring. * **Consistent Pressure:** The spring ensures a specific amount of downward force (pressure) on the electronic chip, which optimizes the thermal interface and prevents the heat sink from shifting during vibration. #### 4. Thermal Interface Material (TIM) Typically, these units come pre-applied with a high-performance thermal phase-change material or grease. This fills the microscopic air gaps between the component (e.g., a microprocessor) and the heat sink base, significantly reducing thermal impedance. --- ### Application Usage This part is commonly found in: * **Telecommunications:** Cooling high-speed networking chips. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from large MOSFETs or IGPT modules.