ATS-18A-131-C2-R0
AI

The **ATS-18A-131-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling integrated circuits (ICs) and other electronic components that generate significant heat during operation.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Thermal Resistance** | 3.60°C/W (at 100 LFM) |
| **Dimensions** | 60mm x 60mm x 20mm |
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### 2. Physical Design & Engineering
The part is engineered to maximize surface area for heat dissipation while maintaining a low profile for space-constrained PCB environments.
* **Fins:** The heat sink features a high-density fin structure. This maximizes the convection surface area, allowing air to carry heat away from the component more efficiently.
* **Material:** It is made from high-grade aluminum, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish provides both corrosion resistance and a slight improvement in radiative heat transfer.
* **Push-Pin Attachment:** The "18A" and "C2" designations indicate specific mounting hardware. Push-pins with flexible springs provide a consistent, pre-determined pressure (clamping force) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM).
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### 3. Thermal Performance Analysis
Thermal resistance is the measure of the part's ability to resist heat flow. Lower values are better. For the ATS-18A-131-C2-R0, the performance varies based on airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (0.5 m/s)** | 3.60 |
| **200 (1.0 m/s)** | 1.80 |
| **400 (2.0 m/s)** | 1.15 |
| **600 (3.0 m/s)** | 0.93 |
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### 4. Part Number Breakdown
The nomenclature for this part follows a specific logic:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **18A:** Designates the specific series/mounting hardware type.
* **131:** Internal model/size code.
* **C2:** Refers to the specific Thermal Interface Material (TIM) and spring force.
* **R0:** Revision code.
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### 5. Common Applications
This part is typically found in:
1. **Networking Hardware:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Voltage regulators and power modules that require active or passive cooling.
- ⤷
What is the difference between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate the required LFM for my specific chip temperature?
- ⤷ What type of Thermal Interface Material is typically pre-applied to this model?