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  • ATS-18A-131-C2-R0

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    The **ATS-18A-131-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed for cooling integrated circuits (ICs) and other electronic components that generate significant heat during operation. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 3.60°C/W (at 100 LFM) | | **Dimensions** | 60mm x 60mm x 20mm | --- ### 2. Physical Design & Engineering The part is engineered to maximize surface area for heat dissipation while maintaining a low profile for space-constrained PCB environments. * **Fins:** The heat sink features a high-density fin structure. This maximizes the convection surface area, allowing air to carry heat away from the component more efficiently. * **Material:** It is made from high-grade aluminum, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish provides both corrosion resistance and a slight improvement in radiative heat transfer. * **Push-Pin Attachment:** The "18A" and "C2" designations indicate specific mounting hardware. Push-pins with flexible springs provide a consistent, pre-determined pressure (clamping force) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). --- ### 3. Thermal Performance Analysis Thermal resistance is the measure of the part's ability to resist heat flow. Lower values are better. For the ATS-18A-131-C2-R0, the performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 3.60 | | **200 (1.0 m/s)** | 1.80 | | **400 (2.0 m/s)** | 1.15 | | **600 (3.0 m/s)** | 0.93 | --- ### 4. Part Number Breakdown The nomenclature for this part follows a specific logic: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18A:** Designates the specific series/mounting hardware type. * **131:** Internal model/size code. * **C2:** Refers to the specific Thermal Interface Material (TIM) and spring force. * **R0:** Revision code. --- ### 5. Common Applications This part is typically found in: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and power modules that require active or passive cooling.
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized heat sinks?
    • ⤷ How do I calculate the required LFM for my specific chip temperature?
    • ⤷ What type of Thermal Interface Material is typically pre-applied to this model?