The **ATS-18A-134-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-18A-134-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 4.44°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 70mm x 70mm x 15mm | | **Fin Type** | Cross-Cut (Pin Fin) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (The Material) The unit is made from **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. #### 2. Fin Geometry (Cross-Cut) Unlike straight-fin heat sinks, this model uses a **cross-cut (pin fin)** design. - **Benefit:** It allows for omnidirectional airflow. If the fan direction in your enclosure changes or if the air is turbulent, the pin fins can still capture and dissipate heat effectively. - **Surface Area:** The 15mm height provides a low profile suitable for tight spaces while maximizing the surface area exposed to moving air. #### 3. Attachment Mechanism (Push Pins) The "18A" series uses a specific mechanical fastening system: * **Brass Push Pins:** These provide a secure and consistent pressure (preload) against the electronic component. * **Stainless Steel Springs:** These ensure that the heat sink maintains firm contact with the chip, even during mechanical shocks or vibrations. #### 4. Thermal Interface Material (TIM) This specific part number typically comes with **T766** pre-applied. * **Function:** T766 is a high-performance thermal phase-change material that fills the microscopic air gaps between the component die and the heat sink base. * **Performance:** It ensures maximum heat transfer efficiency from the silicon to the aluminum. --- ### Use Cases in Electronics This heat sink is commonly found in: 1. **Networking Hardware:** High-speed routers and switches where ASICs generate significant heat. 2. **Industrial PCs:** Compact motherboards where vertical space is limited. 3. **Power Electronics:** Cooling MOSFET arrays or power modules. ---