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  • ATS-18A-14-C2-R0

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    The **ATS-18A-14-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance heat sink series designed for cooling semiconductor packages. ### 1. Component Overview This part is a **push-pin heat sink** designed for thermal management in electronic systems. It is typically used to dissipate heat from CPUs, GPUs, FPGAs, or other integrated circuits (ICs). --- ### 2. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | Description | | :--- | :--- | :--- | | **Part Number** | ATS-18A-14-C2-R0 | Full manufacturer ID | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance | | **Attachment** | Push-Pin | Secure mechanical mounting with integrated springs | | **Dimensions** | 30mm x 30mm x 25mm | Standard square footprint with 25mm height | | **Fin Style** | Straight Fin | Optimized for unidirectional airflow | | **Thermal Resistance** | ~9.97 °C/W (Unducted) | Performance varies based on airflow (LFM) | --- ### 3. Key Electronic Functions Electronic parts like the ATS-18A-14-C2-R0 serve critical roles in hardware reliability: * **Thermal Dissipation:** It increases the surface area of the electronic component, allowing heat to transfer from the silicon die to the ambient air more efficiently. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance thermal phase-change material that fills microscopic air gaps between the IC and the heat sink. * **Mechanical Stability:** The "Push-Pin" mechanism ensures a constant pressure is applied to the chip, which is vital for maintaining consistent thermal contact during vibration or thermal expansion. --- ### 4. Part Number Breakdown The suffixing provides details on the specific variant: * **-C2:** Indicates the material and finish (Blue Anodized Aluminum). * **-R0:** Refers to the revision code or packaging standard. ---
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements for the ATS-18A-14-C2-R0 to achieve maximum cooling?
    • ⤷ How does the push-pin mounting compare to adhesive-based heat sinks?
    • ⤷ Is this heat sink compatible with standard 30x30mm BGA packages?