ATS-18A-14-C2-R0
AI

The **ATS-18A-14-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance heat sink series designed for cooling semiconductor packages.
### 1. Component Overview
This part is a **push-pin heat sink** designed for thermal management in electronic systems. It is typically used to dissipate heat from CPUs, GPUs, FPGAs, or other integrated circuits (ICs).
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### 2. Technical Specifications
The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics.
| Feature | Specification | Description |
| :--- | :--- | :--- |
| **Part Number** | ATS-18A-14-C2-R0 | Full manufacturer ID |
| **Material** | Aluminum | Lightweight with high thermal conductivity |
| **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance |
| **Attachment** | Push-Pin | Secure mechanical mounting with integrated springs |
| **Dimensions** | 30mm x 30mm x 25mm | Standard square footprint with 25mm height |
| **Fin Style** | Straight Fin | Optimized for unidirectional airflow |
| **Thermal Resistance** | ~9.97 °C/W (Unducted) | Performance varies based on airflow (LFM) |
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### 3. Key Electronic Functions
Electronic parts like the ATS-18A-14-C2-R0 serve critical roles in hardware reliability:
* **Thermal Dissipation:** It increases the surface area of the electronic component, allowing heat to transfer from the silicon die to the ambient air more efficiently.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance thermal phase-change material that fills microscopic air gaps between the IC and the heat sink.
* **Mechanical Stability:** The "Push-Pin" mechanism ensures a constant pressure is applied to the chip, which is vital for maintaining consistent thermal contact during vibration or thermal expansion.
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### 4. Part Number Breakdown
The suffixing provides details on the specific variant:
* **-C2:** Indicates the material and finish (Blue Anodized Aluminum).
* **-R0:** Refers to the revision code or packaging standard.
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- ⤷
What are the airflow requirements for the ATS-18A-14-C2-R0 to achieve maximum cooling?
- ⤷ How does the push-pin mounting compare to adhesive-based heat sinks?
- ⤷ Is this heat sink compatible with standard 30x30mm BGA packages?