ATS-18A-141-C2-R0
AI

The **ATS-18A-141-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical "part" of electronic power management, specifically designed for cooling high-heat-generating components like CPUs, FPGAs, and power transistors.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific model:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Part Number** | ATS-18A-141-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 15.76°C/W (@ 100 LFM) |
| **Fin Type** | Fine Pitch (straight fins) |
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## 2. Key Electronic Functions
Though it does not contain circuitry, its role in an electronic system is vital for:
* **Thermal Dissipation:** It increases the surface area of a component to facilitate the transfer of heat into the surrounding air.
* **Preventing Thermal Throttling:** Ensures high-speed processors do not slow down due to overheating.
* **Component Longevity:** Maintains the junction temperature of semiconductors within safe limits to prevent permanent damage.
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## 3. Attachment Mechanism (pushPIN™)
The "R0" suffix refers to the specific attachment kit included. The **pushPIN™** system is an industry-standard mechanism that includes:
1. **A flexible spring:** Provides precise pressure on the component to ensure maximum thermal contact.
2. **Brass or Plastic Pins:** Secure the heat sink to pre-drilled holes in the Printed Circuit Board (PCB).
3. **TIM (Thermal Interface Material):** Usually comes pre-applied (T766 phase-change material) to fill microscopic air gaps between the heat sink and the chip.
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## 4. Airflow Performance Table
Thermal resistance changes based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 15.76 |
| 300 (1.5 m/s) | 9.18 |
| 500 (2.5 m/s) | 7.51 |
| 700 (3.5 m/s) | 6.64 |
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How do I determine if 15.76°C/W is sufficient for my specific processor?
- ⤷ What is the difference between Blue Anodized and Black Anodized finishes in heat sinks?
- ⤷ Are there alternative mounting methods if my PCB doesn't have pushPIN holes?