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  • ATS-18A-141-C2-R0

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    The **ATS-18A-141-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical "part" of electronic power management, specifically designed for cooling high-heat-generating components like CPUs, FPGAs, and power transistors. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-18A-141-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 15.76°C/W (@ 100 LFM) | | **Fin Type** | Fine Pitch (straight fins) | --- ## 2. Key Electronic Functions Though it does not contain circuitry, its role in an electronic system is vital for: * **Thermal Dissipation:** It increases the surface area of a component to facilitate the transfer of heat into the surrounding air. * **Preventing Thermal Throttling:** Ensures high-speed processors do not slow down due to overheating. * **Component Longevity:** Maintains the junction temperature of semiconductors within safe limits to prevent permanent damage. --- ## 3. Attachment Mechanism (pushPIN™) The "R0" suffix refers to the specific attachment kit included. The **pushPIN™** system is an industry-standard mechanism that includes: 1. **A flexible spring:** Provides precise pressure on the component to ensure maximum thermal contact. 2. **Brass or Plastic Pins:** Secure the heat sink to pre-drilled holes in the Printed Circuit Board (PCB). 3. **TIM (Thermal Interface Material):** Usually comes pre-applied (T766 phase-change material) to fill microscopic air gaps between the heat sink and the chip. --- ## 4. Airflow Performance Table Thermal resistance changes based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 15.76 | | 300 (1.5 m/s) | 9.18 | | 500 (2.5 m/s) | 7.51 | | 700 (3.5 m/s) | 6.64 |
    ✨ Follow-up Questions
    • ⤷ How do I determine if 15.76°C/W is sufficient for my specific processor?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes in heat sinks?
    • ⤷ Are there alternative mounting methods if my PCB doesn't have pushPIN holes?