The part number **ATS-18A-147-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) / Compression Spring | | **Thermal Resistance** | 3.96°C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T412 (Chomerics) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS-18**: Refers to the specific series/profile of the heatsink. * **A**: Indicates the material type (Aluminum). * **147**: The specific design/size variant within the series. * **C3**: Indicates the Thermal Interface Material (TIM) and clip/pin options. In this case, it usually refers to **Blue Anodized** finish with a specific spring tension. * **R0**: Revision code. --- ### 3. Key Electronic/Mechanical Features #### A. Thermal Management The primary purpose of this component is to dissipate heat generated by an integrated circuit (IC). With a thermal resistance of approximately **3.96°C/W** at low airflow (100 LFM), it is designed for medium-to-low profile applications where vertical space is limited (only 10mm high). #### B. Push-Pin Attachment Instead of using adhesive tape (which can fail under high heat) or screws (which require more board space), this unit uses a **push-pin and spring system**. * Requires two pre-drilled holes on the PCB. * Provides consistent downward pressure for optimal thermal contact. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **Chomerics T412**. This is a "phase-change" or high-performance tape that fills microscopic air gaps between the heatsink and the chip, significantly improving heat transfer efficiency. #### D. Blue Anodized Finish The blue coating is not just for aesthetics; it provides **corrosion resistance** and increased **surface emissivity**, slightly improving radiation heat transfer. --- ### 4. Application Use Cases * **BGA (Ball Grid Array) Cooling:** Ideal for network processors or FPGAs. * **Embedded Systems:** Used in compact industrial PCs where height is restricted to 10mm. * **Power Electronics:** Cooling voltage regulators or small motor drivers.