The part number **ATS-18A-157-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Advanced Heat Sink Design" series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the critical dimensions and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 3.35°C/W (at 200 LFM) | | **Fin Style** | Straight Fin (for high airflow efficiency) | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied phase change material) | --- ### 2. Electronic/Physical Characteristics This part is not an active electronic component (like a chip) but a **passive thermal management component**. Here is how it functions within an electronic assembly: * **Heat Dissipation:** It uses a "Straight Fin" geometry. This design is optimized for environments where there is a consistent directional airflow (forced convection), allowing heat to be drawn away from the semiconductor junction. * **pushPIN™ Attachment:** The "-R0" designation usually refers to the specific attachment kit. The pushPIN™ system uses a brass or plastic pin and a stainless steel spring to create a secure, high-pressure contact between the heat sink and the PCB. * **Thermal Interface Material (TIM):** The **C2** in the part number indicates the type of TIM applied. This ensures there are no microscopic air gaps between the heat source and the aluminum, maximizing heat transfer. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variations of this part: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **18A** | Series designation (pushPIN™ Heat Sink) | | **157** | Specific physical dimensions and fin count | | **C2** | Thermal Interface Material type (T766) | | **R0** | Packaging/Revision or specific mounting hardware | --- ### 4. Typical Applications * **Telecommunications:** Cooling of routers and network switches. * **Industrial PC:** Cooling of embedded processors in rugged environments. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.