## Overview of ATS-18A-172-C2-R0 The **ATS-18A-172-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "pushPIN™" series, designed specifically for thermal management in compact electronic assemblies. --- ### 1. Key Technical Specifications | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Plastic or Brass pins with springs) | | **Thermal Resistance** | 5.71°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 30.00mm x 30.00mm x 25.00mm | | **Fin Type** | XCUT (Cross-cut pattern) | | **Finish** | Blue Anodized | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical Design & Construction * **XCUT Fin Pattern:** The "XCUT" geometry allows for better airflow from multiple directions. Unlike straight-fin heat sinks, the cross-cut design is ideal for systems where the airflow direction might be unpredictable or restricted. * **Push-Pin Mounting:** This part utilizes a spring-loaded attachment mechanism. This provides a consistent, calculated pressure on the component (CPU, GPU, or FPGA), ensuring optimal thermal contact while preventing damage to the PCB. * **Blue Anodized Coating:** The blue anodization is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiative cooling. --- ### 3. Thermal Performance (Deg C/W) | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | 600 | 700 | |:---|:---:|:---:|:---:|:---:|:---:|:---:|:---:| | **Unducted Flow** | 5.71 | 3.46 | 2.80 | 2.44 | 2.21 | 2.03 | 1.90 | | **Ducted Flow** | 3.39 | 2.54 | 2.16 | 1.93 | 1.77 | 1.65 | 1.55 | --- ### 4. Part Number Breakdown The part number follows a specific nomenclature used by ATS: * **ATS:** Manufacturer prefix. * **18A:** Heat sink series. * **172:** Dimensional/Fin configuration code. * **C2:** Material/Finishing code (Blue Anodized). * **R0:** Revision/Packaging designation. --- ### 5. Common Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Computing:** Secondary processors or bridge chips on motherboards. * **Industrial Power:** Managing heat for power MOSFETs or IGBTs. * **Embedded Systems:** Compact PCB designs requiring high-density cooling.