The **ATS-18A-173-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. ### 1. Technical Specifications The table below highlights the key physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 30.00mm | | **Fin Style** | Fine-Pitch (Cross-Cut) | | **Thermal Resistance** | 4.72 °C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. Thermal Interface Material (TIM) This model comes pre-applied with **T766** thermal interface material. - **Function:** This is a phase-change or high-conductivity paste applied to the base of the heat sink. - **Benefit:** It ensures maximum heat transfer between the electronic component (IC) and the aluminum heat sink by filling microscopic air gaps. #### B. pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical attachment system consisting of: - **Plastic/Brass Push Pins:** Designed to snap into pre-drilled holes in the PCB. - **Compression Springs:** These provide precise, uniform pressure across the component, ensuring consistent thermal contact without damaging the silicon die. #### C. Fin Geometry The "C2" in the part number refers to a specific fin configuration. - **Cross-Cut Design:** The fins are cut both horizontally and vertically. - **Airflow Efficiency:** This design is optimized for "omni-directional" airflow, meaning it performs well regardless of which direction the cooling fan is blowing air across the board. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its role in a circuit design: | Segment | Meaning | | :--- | :--- | | **ATS-18A** | Series/Inventory Code | | **173** | Specific Model/Size ID | | **C2** | Thermal Performance/Fin Density Category | | **R0** | Revision or RoHS Compliance status | --- ### 4. Application Use-Case This part is typically found in: - **Telecommunications:** Network switches and routers. - **Embedded Computing:** Single-board computers (SBCs) where vertical space allows for a 30mm height. - **Power Supplies:** Cooling MOSFETs or voltage regulators that generate concentrated heat.