Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18A-174-C2-R0

  • AI
    The part number **ATS-18A-174-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *pushPIN™* series, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 4.02 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Fin Style** | Fine Pitch (Square Fin) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention: * **ATS-18A**: The series identifier. "18" refers to the specific geometry, and "A" denotes a standard density. * **174**: The specific size profile/model number within the series. * **C2**: Refers to the **Thermal Interface Material (TIM)**. C2 indicates that **T766** (a high-performance thermal grease) is pre-applied. * **R0**: Refers to the packaging and revision status. --- ### 3. Key Features * **Push-Pin Attachment:** The heat sink uses a flexible attachment system with stainless steel springs. This provides a precise and firm pressure to ensure maximum thermal contact with the component. * **Optimal Fin Design:** The fins are arranged in a square pattern (Fine Pitch), which allows for efficient heat dissipation in both natural convection and forced-air environments. * **Pre-applied TIM:** Because it comes with T766 thermal grease, it is ready for immediate installation, reducing assembly time and ensuring a consistent layer of thermal conductor. * **Lightweight Construction:** Made from Aluminum 6063, it balances weight with high thermal conductivity. --- ### 4. Thermal Performance Thermal resistance varies based on the airflow (Velocity) across the fins: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.02 | | 200 (1.0 m/s) | 2.56 | | 300 (1.5 m/s) | 2.11 | | 400 (2.0 m/s) | 1.87 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment system?
    • ⤷ Can this heat sink be used without a fan (passive cooling)?
    • ⤷ What is the difference between the C1 and C2 thermal material options?