ATS-18A-174-C2-R0
AI

The part number **ATS-18A-174-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *pushPIN™* series, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 4.02 °C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm |
| **Fin Style** | Fine Pitch (Square Fin) |
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### 2. Breakdown of the Part Number
The alphanumeric code follows a specific naming convention:
* **ATS-18A**: The series identifier. "18" refers to the specific geometry, and "A" denotes a standard density.
* **174**: The specific size profile/model number within the series.
* **C2**: Refers to the **Thermal Interface Material (TIM)**. C2 indicates that **T766** (a high-performance thermal grease) is pre-applied.
* **R0**: Refers to the packaging and revision status.
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### 3. Key Features
* **Push-Pin Attachment:** The heat sink uses a flexible attachment system with stainless steel springs. This provides a precise and firm pressure to ensure maximum thermal contact with the component.
* **Optimal Fin Design:** The fins are arranged in a square pattern (Fine Pitch), which allows for efficient heat dissipation in both natural convection and forced-air environments.
* **Pre-applied TIM:** Because it comes with T766 thermal grease, it is ready for immediate installation, reducing assembly time and ensuring a consistent layer of thermal conductor.
* **Lightweight Construction:** Made from Aluminum 6063, it balances weight with high thermal conductivity.
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### 4. Thermal Performance
Thermal resistance varies based on the airflow (Velocity) across the fins:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 4.02 |
| 200 (1.0 m/s) | 2.56 |
| 300 (1.5 m/s) | 2.11 |
| 400 (2.0 m/s) | 1.87 |
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- ⤷
What are the PCB hole requirements for the pushPIN attachment system?
- ⤷ Can this heat sink be used without a fan (passive cooling)?
- ⤷ What is the difference between the C1 and C2 thermal material options?