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  • ATS-18A-175-C2-R0

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    The **ATS-18A-175-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number describes specific mechanical and thermal characteristics. Below is a breakdown of its key specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Thermal Performance The efficiency of a heat sink is measured by its thermal resistance (lower is better). For this model, the performance varies based on the airflow (velocity): * **@100 LFM (0.5 m/s):** ~13.52 °C/W * **@200 LFM (1.0 m/s):** ~7.53 °C/W * **@500 LFM (2.5 m/s):** ~4.54 °C/W --- ### 3. Key Electronic Components & Design Features The "electronic parts" of this assembly include the physical structure and the materials used to bridge the gap between the heat source and the cooling environment: #### A. XCUT Fin Design The heat sink features a **straight fin, cross-cut** pattern. This allows for multi-directional airflow, which is critical in dense electronic enclosures where the direction of the cooling fan may not be perfectly aligned with the heat sink. #### B. Push-Pin Mounting System Instead of using adhesive tapes, which can degrade over time, this part uses **brass push-pins**. * **Reliability:** Provides consistent pressure for better thermal contact. * **Ease of Assembly:** Quickly snaps into pre-drilled holes on the PCB. #### C. Thermal Interface Material (T766) The base is pre-applied with **T766 phase-change material**. This is a crucial "electronic" component that: 1. Fills microscopic air gaps between the chip and the aluminum base. 2. Ensures maximum heat transfer efficiency (lowers contact resistance). --- ### 4. Part Number Decoder | Suffix | Meaning | | :--- | :--- | | **18A** | Series identification | | **175** | Specific dimensions/fin configuration | | **C2** | Color/Finish (Blue Anodized) | | **R0** | RoHS compliant / Revision level | ---
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern spacing required on the PCB for this heat sink?
    • ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?
    • ⤷ Does this heat sink come in different heights for tighter enclosures?