ATS-18A-175-C2-R0
AI

The **ATS-18A-175-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
The part number describes specific mechanical and thermal characteristics. Below is a breakdown of its key specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm |
| **Fin Style** | XCUT (Cross-cut) |
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### 2. Thermal Performance
The efficiency of a heat sink is measured by its thermal resistance (lower is better). For this model, the performance varies based on the airflow (velocity):
* **@100 LFM (0.5 m/s):** ~13.52 °C/W
* **@200 LFM (1.0 m/s):** ~7.53 °C/W
* **@500 LFM (2.5 m/s):** ~4.54 °C/W
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### 3. Key Electronic Components & Design Features
The "electronic parts" of this assembly include the physical structure and the materials used to bridge the gap between the heat source and the cooling environment:
#### A. XCUT Fin Design
The heat sink features a **straight fin, cross-cut** pattern. This allows for multi-directional airflow, which is critical in dense electronic enclosures where the direction of the cooling fan may not be perfectly aligned with the heat sink.
#### B. Push-Pin Mounting System
Instead of using adhesive tapes, which can degrade over time, this part uses **brass push-pins**.
* **Reliability:** Provides consistent pressure for better thermal contact.
* **Ease of Assembly:** Quickly snaps into pre-drilled holes on the PCB.
#### C. Thermal Interface Material (T766)
The base is pre-applied with **T766 phase-change material**. This is a crucial "electronic" component that:
1. Fills microscopic air gaps between the chip and the aluminum base.
2. Ensures maximum heat transfer efficiency (lowers contact resistance).
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### 4. Part Number Decoder
| Suffix | Meaning |
| :--- | :--- |
| **18A** | Series identification |
| **175** | Specific dimensions/fin configuration |
| **C2** | Color/Finish (Blue Anodized) |
| **R0** | RoHS compliant / Revision level |
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- ⤷
What is the hole pattern spacing required on the PCB for this heat sink?
- ⤷ Can the T766 thermal interface material be replaced with standard thermal paste?
- ⤷ Does this heat sink come in different heights for tighter enclosures?