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  • ATS-18A-18-C2-R0

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    The **ATS-18A-18-C2-R0** is a specific electronic component belonging to the **Heat Sink** category, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for high-performance cooling of electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.84°C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm | --- ## 2. Component Breakdown ### A. The Heat Sink Body The "18-C2" designation refers to the specific fin geometry and height. * **Design:** It typically features a cross-cut or straight-fin design to maximize surface area. * **Material:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** coating protects against corrosion and improves emissivity. ### B. The Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the **R0** suffix indicates a mechanical attachment: * **Push-Pins:** These are inserted through pre-drilled holes in the Printed Circuit Board (PCB). * **Springs:** The compression springs provide a calculated amount of downward force (pressure), ensuring the heat sink stays in constant contact with the chip, even under vibration or thermal expansion. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** This material fills microscopic air gaps between the component surface and the heat sink base to significantly lower thermal resistance. --- ## 3. Part Number Decoder Understanding the manufacturer's nomenclature: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **18A** | Series / Profile Identifier | | **18** | Specific Fin Pattern/Height Code | | **C2** | Material/Finish (Blue Anodized Aluminum) | | **R0** | Revision / Packaging Code | --- ## 4. Typical Applications * **Telecommunications:** Used in routers and switches to cool high-speed processing chips. * **Industrial PCs:** Ensuring stability in environments with high ambient temperatures. * **Power Supplies:** Cooling voltage regulators and MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting the ATS-18A-18-C2-R0?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ What is the maximum power dissipation (in Watts) this heat sink can handle?