ATS-18A-18-C2-R0
AI

The **ATS-18A-18-C2-R0** is a specific electronic component belonging to the **Heat Sink** category, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for high-performance cooling of electronic components like CPUs, GPUs, and FPGAs.
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## 1. Technical Specifications
Below are the primary physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 4.84°C/W @ 100 LFM |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 15.0mm |
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## 2. Component Breakdown
### A. The Heat Sink Body
The "18-C2" designation refers to the specific fin geometry and height.
* **Design:** It typically features a cross-cut or straight-fin design to maximize surface area.
* **Material:** Aluminum is used for its excellent thermal conductivity-to-weight ratio. The **Blue Anodized** coating protects against corrosion and improves emissivity.
### B. The Attachment Mechanism (Push-Pins)
Unlike adhesive-based heat sinks, the **R0** suffix indicates a mechanical attachment:
* **Push-Pins:** These are inserted through pre-drilled holes in the Printed Circuit Board (PCB).
* **Springs:** The compression springs provide a calculated amount of downward force (pressure), ensuring the heat sink stays in constant contact with the chip, even under vibration or thermal expansion.
### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base.
* **Function:** This material fills microscopic air gaps between the component surface and the heat sink base to significantly lower thermal resistance.
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## 3. Part Number Decoder
Understanding the manufacturer's nomenclature:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **18A** | Series / Profile Identifier |
| **18** | Specific Fin Pattern/Height Code |
| **C2** | Material/Finish (Blue Anodized Aluminum) |
| **R0** | Revision / Packaging Code |
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## 4. Typical Applications
* **Telecommunications:** Used in routers and switches to cool high-speed processing chips.
* **Industrial PCs:** Ensuring stability in environments with high ambient temperatures.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
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- ⤷
What are the PCB hole requirements for mounting the ATS-18A-18-C2-R0?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ What is the maximum power dissipation (in Watts) this heat sink can handle?