ATS-18A-186-C2-R0
AI

## Overview of ATS-18A-186-C2-R0
The **ATS-18A-186-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs where space is limited and thermal efficiency is critical.
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### 1. Key Technical Specifications
Below is a breakdown of the primary physical and thermal characteristics:
| Property | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Heat Sink Type** | maxiFLOW™ (Flared Fin) |
| **Material** | Aluminum (Blue Anodized) |
| **Mounting Type** | pushPIN™ |
| **Thermal Resistance** | 2.80°C/W @ 200 LFM (Airflow) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Design Features
The part incorporates several specific engineering choices to optimize heat dissipation:
* **Flared Fin Geometry:** The fins are flared outward, which increases the surface area and creates turbulence in the airflow, significantly improving cooling performance compared to straight-fin designs.
* **pushPIN™ Attachment:** It utilizes a specialized mounting system consisting of a flexible spring and a plastic pin. This ensures a precise, secure, and repeatable attachment to the PCB without the need for tools.
* **Material and Finish:** Made from high-grade aluminum for lightweight thermal conductivity, finished with a blue anodized coating to prevent corrosion and improve thermal radiation.
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### 3. Application Use Cases
This component is typically used in the following electronic environments:
1. **Telecommunications:** Cooling of networking chips in routers and switches.
2. **Embedded Systems:** High-performance computing modules that generate significant heat in a small footprint.
3. **Power Electronics:** Managing heat for voltage regulators or high-power transistors.
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### 4. Comparison Table: Thermal Performance
Thermal resistance varies based on the velocity of air (Linear Feet per Minute - LFM) passing through the fins:
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 2.80 |
| **300 (1.5 m/s)** | 1.76 |
| **400 (2.0 m/s)** | 1.43 |
| **600 (3.0 m/s)** | 1.10 |
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What is the difference between T766 and other thermal interface materials used by ATS?
- ⤷ How do I calculate the correct hole size on a PCB for the pushPIN mounting system?
- ⤷ Are there low-profile versions of the maxiFLOW series available for 1U rack applications?