Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18A-186-C2-R0

  • AI
    ## Overview of ATS-18A-186-C2-R0 The **ATS-18A-186-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, specifically designed for cooling electronic components such as processors, FPGAs, and ASICs where space is limited and thermal efficiency is critical. --- ### 1. Key Technical Specifications Below is a breakdown of the primary physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | maxiFLOW™ (Flared Fin) | | **Material** | Aluminum (Blue Anodized) | | **Mounting Type** | pushPIN™ | | **Thermal Resistance** | 2.80°C/W @ 200 LFM (Airflow) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Features The part incorporates several specific engineering choices to optimize heat dissipation: * **Flared Fin Geometry:** The fins are flared outward, which increases the surface area and creates turbulence in the airflow, significantly improving cooling performance compared to straight-fin designs. * **pushPIN™ Attachment:** It utilizes a specialized mounting system consisting of a flexible spring and a plastic pin. This ensures a precise, secure, and repeatable attachment to the PCB without the need for tools. * **Material and Finish:** Made from high-grade aluminum for lightweight thermal conductivity, finished with a blue anodized coating to prevent corrosion and improve thermal radiation. --- ### 3. Application Use Cases This component is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking chips in routers and switches. 2. **Embedded Systems:** High-performance computing modules that generate significant heat in a small footprint. 3. **Power Electronics:** Managing heat for voltage regulators or high-power transistors. --- ### 4. Comparison Table: Thermal Performance Thermal resistance varies based on the velocity of air (Linear Feet per Minute - LFM) passing through the fins: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 2.80 | | **300 (1.5 m/s)** | 1.76 | | **400 (2.0 m/s)** | 1.43 | | **600 (3.0 m/s)** | 1.10 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between T766 and other thermal interface materials used by ATS?
    • ⤷ How do I calculate the correct hole size on a PCB for the pushPIN mounting system?
    • ⤷ Are there low-profile versions of the maxiFLOW series available for 1U rack applications?