The **ATS-18A-189-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed specifically for cooling electronic components like processors, FPGAs, and ASICs. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 2.43 °C/W @ 200 LFM | | **Attachment Method** | pushPIN™ (Brass pins) | | **Interface Material** | T766 (Thermal Tape) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Design and Components The part is engineered to maximize surface area while minimizing pressure drop. #### A. Fin Geometry (maxiFLOW™) Unlike standard straight-fin heat sinks, the **maxiFLOW** design features a spread-fin pattern. This increases the surface area exposed to air while allowing for better airflow distribution, which is critical in high-density PCB environments. #### B. pushPIN™ Attachment System This component uses a mechanical mounting system instead of just adhesive. It includes: * **Brass Pins:** Provide a secure mechanical connection to the PCB. * **Compression Springs:** Ensure consistent pressure (clamping force) between the heat sink and the component, which optimizes heat transfer. * **Plastic/Brass Grommets:** Used to lock the pins into pre-drilled holes on the motherboard. #### C. Phase Change / Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal interface material applied to the base. It typically uses **T766**, a high-performance thermal tape that facilitates the conduction of heat from the electronic chip into the aluminum body of the heat sink. --- ### 3. Thermal Performance Metrics Thermal resistance (measured in °C/W) indicates how effectively the part dissipates heat. Lower numbers are better. * **@ 200 LFM (Linear Feet per Minute):** 2.43 °C/W * **@ 400 LFM:** 1.54 °C/W * **@ 600 LFM:** 1.23 °C/W --- ### 4. Applications This part is commonly used for cooling: 1. **Network Switches/Routers:** For high-speed data processing chips. 2. **Industrial PC (IPC):** Where vibration resistance is needed (provided by the pushPINs). 3. **Power Supplies:** Cooling MOSFETs or power regulators.