ATS-18A-202-C2-R0
AI

The **ATS-18A-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for precision cooling of electronic integrated circuits (ICs) and other heat-generating components on a PCB.
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### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-18A-202-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) |
| **Dimensions (L x W)** | 54.00 mm x 54.00 mm |
| **Height (H)** | 6.00 mm |
| **Pitch** | Super Fine |
| **Thermal Resistance** | 14.83 °C/W (Unducted Flow @ 100 LFM) |
---
### 2. Design and Component Breakdown
#### A. Fin Profile (Super Fine Pitch)
The "Super Fine" pitch design provides a high surface area-to-volume ratio. This is critical for low-profile heat sinks (only 6mm high) to ensure maximum heat dissipation even when vertical space is restricted.
#### B. Attachment Mechanism: pushPIN™
Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™** system:
* **Spring-Loaded:** Provides consistent pressure across the interface for optimal thermal transfer.
* **Compression Springs:** Ensure the heat sink remains secure during mechanical shock or vibration.
* **Plastic/Brass Pins:** Designed to snap into pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The "C2" designation typically indicates that the heat sink comes pre-applied with **T766 phase-change material** or a high-performance thermal grease, ensuring that the microscopic air gaps between the component and the heat sink are filled for better conductivity.
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### 3. Thermal Performance Matrix
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) provided by the system fans.
| Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (Unducted)** | 14.83 °C/W | 8.31 °C/W | 6.68 °C/W | 5.82 °C/W |
| **Thermal Resistance (Ducted)** | 7.23 °C/W | 5.34 °C/W | 4.51 °C/W | 4.03 °C/W |
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### 4. Part Number Breakdown (Nomenclature)
```text
ATS - 18 A - 202 - C2 - R0
| | | | | |
| | | | | └─ Revision Code
| | | | └────── Thermal Interface Material (T766)
| | | └──────────── Part Sequence/Size ID
| | └───────────────── Fin Pitch (Super Fine)
| └─────────────────── Series/Attachment Type
└───────────────────────── Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ Can this heat sink be used for passive cooling without a fan?
- ⤷ How does the 'Blue Anodized' finish affect thermal radiation?