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  • ATS-18A-202-C2-R0

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    The **ATS-18A-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for precision cooling of electronic integrated circuits (ICs) and other heat-generating components on a PCB. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-18A-202-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pegs) | | **Dimensions (L x W)** | 54.00 mm x 54.00 mm | | **Height (H)** | 6.00 mm | | **Pitch** | Super Fine | | **Thermal Resistance** | 14.83 °C/W (Unducted Flow @ 100 LFM) | --- ### 2. Design and Component Breakdown #### A. Fin Profile (Super Fine Pitch) The "Super Fine" pitch design provides a high surface area-to-volume ratio. This is critical for low-profile heat sinks (only 6mm high) to ensure maximum heat dissipation even when vertical space is restricted. #### B. Attachment Mechanism: pushPIN™ Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™** system: * **Spring-Loaded:** Provides consistent pressure across the interface for optimal thermal transfer. * **Compression Springs:** Ensure the heat sink remains secure during mechanical shock or vibration. * **Plastic/Brass Pins:** Designed to snap into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "C2" designation typically indicates that the heat sink comes pre-applied with **T766 phase-change material** or a high-performance thermal grease, ensuring that the microscopic air gaps between the component and the heat sink are filled for better conductivity. --- ### 3. Thermal Performance Matrix Performance varies based on the airflow (measured in Linear Feet per Minute - LFM) provided by the system fans. | Air Velocity (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | 700 (3.5 m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 14.83 °C/W | 8.31 °C/W | 6.68 °C/W | 5.82 °C/W | | **Thermal Resistance (Ducted)** | 7.23 °C/W | 5.34 °C/W | 4.51 °C/W | 4.03 °C/W | --- ### 4. Part Number Breakdown (Nomenclature) ```text ATS - 18 A - 202 - C2 - R0 | | | | | | | | | | | └─ Revision Code | | | | └────── Thermal Interface Material (T766) | | | └──────────── Part Sequence/Size ID | | └───────────────── Fin Pitch (Super Fine) | └─────────────────── Series/Attachment Type └───────────────────────── Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?
    • ⤷ Can this heat sink be used for passive cooling without a fan?
    • ⤷ How does the 'Blue Anodized' finish affect thermal radiation?