The **ATS-18A-26-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by **Advanced Thermal Solutions (ATS)** and belongs to the **maxiFLOW™** series. --- ## 1. Core Specifications The following table outlines the physical and technical properties of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Category** | Heat Sinks | | **Series** | maxiFLOW™ | | **Dimensions** | 48.26mm x 48.26mm | | **Height** | 17.78mm | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 1.42°C/W (at 200 LFM) | --- ## 2. Key Component Features ### A. maxiFLOW™ Design The "maxiFLOW" geometry features a spread-fin design. Unlike standard straight-fin heat sinks, these fins flare outwards, which: * Reduces pressure drop. * Increases the surface area for convection. * Optimizes airflow from all directions. ### B. pushPIN™ Attachment The "R0" at the end of the part number indicates the specific attachment kit. This system uses: * **Compression Springs:** Provides precise pressure to ensure optimal thermal interface contact. * **Plastic/Brass Push Pins:** Designed to fit into pre-drilled holes on the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The part comes pre-applied with **chomerics T766**, a high-performance phase-change material. This ensures that the heat transfer between the electronic component (CPU, GPU, or FPGA) and the aluminum base is maximized without requiring manual paste application. --- ## 3. Nomenclature Breakdown To understand what each segment of **ATS-18A-26-C2-R0** means: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18A** | Series/Internal Designator | | **26** | Specific Height/Form Factor code | | **C2** | Thermal Performance Grade / Material Coating (Blue Anodized) | | **R0** | Packaging and Attachment Type (pushPIN™) | --- ## 4. Typical Applications This component is designed for high-heat density electronic environments where vertical space is limited but high cooling efficiency is required: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** High-efficiency voltage regulators.