The **ATS-18A-28-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW" series, designed to maximize airflow and dissipate heat from surface-mount components. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Type** | Passive Heat Sink | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 10.57°C/W (Unducted Flow @ 100 LFM) | | **Flow Direction** | Undirectional / High Flow | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | --- ### 2. Key Features The "C2" and "R0" suffixes in the part number denote specific material and compliance standards: * **pushPIN™ Attachment:** This design allows for a secure, repeatable, and vibration-resistant mount to the PCB without requiring complex tools. * **Thermal Interface Material (TIM):** The part typically comes with a pre-applied high-performance phase-change material or thermal tape (specifically **T766**), which fills microscopic air gaps between the component and the heat sink. * **maxiFLOW™ Design:** It features a flared fin structure that increases the surface area while maintaining a low pressure drop, making it ideal for systems with high-velocity air cooling. * **RoHS Compliant:** The "R0" suffix indicates the part meets standard environmental regulations regarding lead and other hazardous substances. --- ### 3. Thermal Performance Comparison Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.57 | | 200 (1.0 m/s) | 4.04 | | 400 (2.0 m/s) | 2.50 | | 600 (3.0 m/s) | 1.87 | --- ### 4. Typical Applications This component is commonly used to cool high-heat electronic devices such as: 1. **Microprocessors (CPUs)** and Microcontrollers. 2. **FPGA/ASIC** chips used in networking gear. 3. **Power Converters** (DC-DC) that generate significant localized heat. 4. **Graphics Processors (GPUs)** in embedded systems.