The **ATS-18A-29-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by **Advanced Thermal Solutions, Inc. (ATS)** and belongs to their "maxiFLOW" product line, designed for cooling electronic components like BGA (Ball Grid Array) chips. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | maxiFLOW™ | | **Base Dimensions** | 45mm x 45mm | | **Height** | 20mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.57°C/W (at 100 LFM) | --- ### 2. Key Design Features The "C2" and "R0" suffixes in the part number indicate specific material and finish properties: * **maxiFLOW™ Design:** Features a flared fin geometry that increases the surface area for heat dissipation while maximizing airflow through the fin field. * **pushPIN™ Attachment:** This system includes a flexible spring mechanism that allows for secure mounting to the PCB (Printed Circuit Board) through pre-drilled holes, ensuring consistent pressure and optimal thermal contact. * **Thermal Interface Material (TIM):** The **"C2"** designation typically refers to the use of **T766** thermal phase change material, which is pre-applied to the base to improve heat transfer from the component to the sink. * **Finish:** The **"R0"** indicates compliance with RoHS standards and identifies the specific Blue Anodized coating used to prevent corrosion and improve emissivity. --- ### 3. Application Use Cases This part is commonly found in industrial and high-speed computing environments where heat management is critical for component longevity. 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Processors:** Cooling for FPGAs, ASICs, and GPUs where space is limited but thermal loads are high. 3. **Power Electronics:** Used in power supplies to dissipate heat from transistors or voltage regulators. --- ### 4. Thermal Performance Overview Thermal resistance is dependent on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.57 | | 200 | 1.0 | 2.45 | | 300 | 1.5 | 1.70 | | 400 | 2.0 | 1.39 |