The **ATS-18A-31-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. Produced by Advanced Thermal Solutions (ATS), it is a high-performance heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 6.90mm | | **Thermal Resistance** | 25.25°C/W (Unducted Flow) | | **Airflow Direction** | Vertical/Horizontal (depends on fin orientation) | --- ## 2. Key Design Elements ### A. pushPIN™ Attachment Unlike adhesive tapes or clips, this unit uses a **Push-Pin** mechanism. This ensures: * **Constant Pressure:** The spring-loaded pins provide uniform pressure across the component surface, maximizing heat transfer. * **Secure Mounting:** It prevents the heat sink from shifting during vibration or mechanical shock. * **Reusability:** The assembly can be removed and re-installed without damaging the PCB or leaving adhesive residue. ### B. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight properties and high thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; the anodization process increases surface emissivity, slightly improving radiation cooling and protecting the aluminum from corrosion. ### C. Low Profile With a height of only **6.90mm**, this heat sink is categorized as "Low Profile." It is specifically designed for space-constrained environments such as 1U server chassis, small form factor (SFF) PCs, or compact embedded systems. --- ## 3. Thermal Performance Metrics Thermal resistance is measured in °C/W (Celsius per Watt). The performance varies based on the velocity of the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 25.25 | | 200 | 1.0 | 5.82 | | 300 | 1.5 | 4.28 | | 400 | 2.0 | 3.59 | *Note: The dramatic drop in resistance between 100 LFM and 200 LFM indicates this heat sink is highly dependent on active airflow to be effective.* --- ## 4. Typical Applications * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecommunications:** Network switches and routers where vertical space is limited. * **Industrial PCs:** Providing heat dissipation for processors or chipsets in rugged environments.