The part number **ATS-18A-33-C3-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ## 1. Technical Specifications The part number is a coded string that describes the physical and thermal properties of the component. | Specification | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Fin Type** | straight-fin | | **Thermal Resistance** | 17.50° C/W (at 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Finish** | Blue Anodized | --- ## 2. Component Breakdown The ATS-18A-33-C3-R0 is more than just a piece of metal; it is a mechanical assembly designed for electronic reliability. ### Thermal Interface Material (TIM) The **"C3"** in the part number indicates that the heatsink comes pre-applied with **T766 phase-change material**. This is a high-performance thermal pad that melts and fills microscopic gaps between the chip and the heatsink, ensuring maximum heat transfer. ### Attachment Mechanism (pushPIN™) Instead of using messy adhesives or weak tape, this part uses a **pushPIN™** system: * **Spring-loaded:** Ensures constant pressure on the electronic component to maintain thermal contact. * **Brass/Plastic Pins:** Secure the heatsink directly to the PCB through pre-drilled holes. ### Material and Finish * **Aluminum 6063:** Chosen for its balance of high thermal conductivity and structural strength. * **Blue Anodized Coating:** Provides corrosion resistance and electrical insulation, preventing accidental shorts if the heatsink touches nearby components. --- ## 3. Usage Context This specific heatsink is typically found in: 1. **Networking Equipment:** Routers and switches with mid-range processing chips. 2. **Industrial Controls:** Cooling for power management ICs. 3. **Embedded Systems:** High-heat components where vertical space is limited (15mm height). ---