ATS-18A-38-C2-R0
AI

The part number **ATS-18A-38-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component is part of their "maxiFLOW" series, designed to optimize airflow and thermal dissipation for electronic components like CPUs, GPUs, or FPGAs.
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## Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | maxiFLOW™ |
| **Material** | Aluminum |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 6.42°C/W (at 1.0 m/s) |
| **Dimensions (L x W)** | 36.83mm x 41.28mm |
| **Height** | 22.86mm |
| **Finish** | Blue Anodized |
| **Thermal Interface Material** | T766 (Pre-applied) |
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## Key Components and Features
### 1. maxiFLOW™ Design
The heatsink features a tapered fin design that maximizes the surface area for cooling while minimizing pressure drop. This allows it to perform efficiently in systems with limited airflow.
### 2. pushPIN™ Attachment
Instead of using messy thermal glues or simple clips, this part uses a **pushPIN™ system**.
* **Mechanism:** It uses a brass or plastic pin with a high-tension spring.
* **Reliability:** This ensures a consistent pressure (Force) against the electronic component, which improves thermal transfer.
### 3. Thermal Interface Material (TIM)
The "C2" in the part number indicates the type of **Thermal Interface Material** pre-applied to the base.
* **T766:** A high-performance thermal pad/grease that fills microscopic air gaps between the component and the heatsink.
### 4. Material and Coating
* **Aluminum:** Chosen for its lightweight properties and good thermal conductivity.
* **Blue Anodized:** The finish is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative cooling and providing corrosion resistance.
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## Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **18A** | Series / Catalog Identifier |
| **38** | Specific dimension/form factor code |
| **C2** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant / Revision code |
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- ⤷
What are the PCB hole requirements for the pushPIN attachment?
- ⤷ How does this heatsink compare to a standard cross-cut design?
- ⤷ What is the weight of this specific heatsink model?