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  • ATS-18A-38-C2-R0

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    The part number **ATS-18A-38-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. This specific component is part of their "maxiFLOW" series, designed to optimize airflow and thermal dissipation for electronic components like CPUs, GPUs, or FPGAs. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 6.42°C/W (at 1.0 m/s) | | **Dimensions (L x W)** | 36.83mm x 41.28mm | | **Height** | 22.86mm | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Key Components and Features ### 1. maxiFLOW™ Design The heatsink features a tapered fin design that maximizes the surface area for cooling while minimizing pressure drop. This allows it to perform efficiently in systems with limited airflow. ### 2. pushPIN™ Attachment Instead of using messy thermal glues or simple clips, this part uses a **pushPIN™ system**. * **Mechanism:** It uses a brass or plastic pin with a high-tension spring. * **Reliability:** This ensures a consistent pressure (Force) against the electronic component, which improves thermal transfer. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of **Thermal Interface Material** pre-applied to the base. * **T766:** A high-performance thermal pad/grease that fills microscopic air gaps between the component and the heatsink. ### 4. Material and Coating * **Aluminum:** Chosen for its lightweight properties and good thermal conductivity. * **Blue Anodized:** The finish is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative cooling and providing corrosion resistance. --- ## Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **18A** | Series / Catalog Identifier | | **38** | Specific dimension/form factor code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN attachment?
    • ⤷ How does this heatsink compare to a standard cross-cut design?
    • ⤷ What is the weight of this specific heatsink model?