## Electronic Analysis: ATS-18A-39-C2-R0 The **ATS-18A-39-C2-R0** is a high-performance **heat sink** assembly manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-powered electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Part Number Breakdown Understanding the nomenclature helps identify the physical and thermal specifications: | Segment | Value | Description | | :--- | :--- | :--- | | **ATS** | Manufacturer | Advanced Thermal Solutions | | **18A** | Series | maxiFLOW™ (High-performance fin design) | | **39** | Dimensions | Refers to height and width specifications (approx. 48mm x 48mm footprint) | | **C2** | Thermal Interface | Pre-applied T766 Phase Change Material | | **R0** | Finish/RoHS | Blue Anodized finish, RoHS compliant | --- ### 2. Physical Characteristics This part is characterized by its unique "flared fin" geometry, which maximizes surface area while reducing pressure drop. * **Material:** Aluminum (6063) for optimal thermal conductivity and weight. * **Finish:** Blue Anodized (increases surface emissivity and provides corrosion resistance). * **Dimensions:** 47.60 mm x 48.30 mm. * **Height:** 12.70 mm (Low profile). * **Attachment Method:** Typically uses a **maxiGRIP™** attachment system (steady pressure without drilling holes in the PCB). --- ### 3. Thermal Performance The efficiency of this component is measured by its thermal resistance ($^\circ \text{C/W}$). A lower number indicates better heat dissipation. | Airflow Velocity (LFM) | Thermal Resistance ($^\circ \text{C/W}$) | | :--- | :--- | | 200 (Unducted) | 3.58 | | 300 (Unducted) | 2.83 | | 400 (Unducted) | 2.45 | | 500 (Unducted) | 2.20 | --- ### 4. Technical Key Features * **Flared Fin Design:** The fins spread outward to capture more airflow from a cooling fan, making it more efficient than straight-fin designs in low-airflow environments. * **T766 Thermal Interface Material (TIM):** The "C2" suffix indicates it comes with a high-performance phase-change material already applied to the base, ensuring minimal thermal resistance between the component and the heat sink. * **Push-Pin/Clip Compatibility:** Designed for high-reliability environments where vibration might be an issue. --- ### 5. Common Applications This heat sink is typically found in: * **Telecommunications:** Network switches and routers. * **Industrial Computing:** Embedded systems requiring long-term reliability. * **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.