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  • ATS-18A-49-C3-R0

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    The **ATS-18A-49-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Series** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (typically AL6063) | | **Thermal Resistance** | 2.73°C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Base Finish** | Blue Anodized | | **TIM (Thermal Interface Material)** | T412 (Pre-applied) | --- ### 2. Physical Dimensions The "49" in the part number indicates the size of the heat sink base. * **Length (A):** 54.00 mm * **Width (B):** 54.00 mm * **Height (C):** 20.00 mm * **Hole Pattern (E/F):** 47.00 mm x 47.00 mm --- ### 3. Key Electronic Functions While the heat sink itself is passive (no moving parts), it serves critical functions in an electronic system: 1. **Thermal Dissipation:** It increases the surface area of the heat-generating component (the IC), allowing air to carry away heat via convection. 2. **Thermal Interface:** The pre-applied **T412 material** ensures that there are no microscopic air gaps between the chip and the aluminum base, maximizing heat transfer efficiency. 3. **Cross-Cut Design:** The "fins" are designed in a cross-cut pattern, which allows for multi-directional airflow, making it versatile for different PCB orientations. 4. **Mechanical Stability:** The push-pin mechanism provides a precise and repeatable compression force, preventing damage to sensitive silicon dies while ensuring a tight thermal contact. --- ### 4. Part Number Breakdown The suffix code provides information on the specific material and finish: * **C3:** Refers to the specific heat sink material and thermal performance class. * **R0:** Refers to the RoHS compliance and standard packaging/revision. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between T412 and other thermal interface materials?
    • ⤷ How do I calculate if the 2.73°C/W thermal resistance is sufficient for my CPU?
    • ⤷ What are the advantages of push-pin mounting over spring-loaded screws?