The **ATS-18A-51-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks. Below is the technical breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is a high-efficiency heat sink designed for cooling surface-mount components (like BGA, FPGA, or CPU) in environments with constrained airflow. | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Part Number** | ATS-18A-51-C2-R0 | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum (Body) / Copper (optional base) | | **Finish** | Blue Anodized | --- ### 2. Thermal Performance The primary function of this part is to dissipate heat. Thermal resistance is measured in **°C/W** (lower is better). | Airflow Rate (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 200 LFM (1.0 m/s) | 6.69 °C/W | | 300 LFM (1.5 m/s) | 5.13 °C/W | | 400 LFM (2.0 m/s) | 4.36 °C/W | | 500 LFM (2.5 m/s) | 3.89 °C/W | --- ### 3. Physical Dimensions The geometry is critical for ensuring it fits on a Printed Circuit Board (PCB) without interfering with other components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height:** 20.00 mm * **Pin Pitch (Hole to Hole):** 45.00 mm --- ### 4. Component Features * **maxiFLOW™ Design:** Features a graduated fin pattern that maximizes surface area and increases air turbulence, improving heat transfer. * **pushPIN™ Attachment:** The "-R0" suffix indicates a specialized attachment system using brass or plastic pins and a stainless steel spring. This provides a precise "compression force" to ensure optimal contact with the electronic chip. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **ATS-CPX - T766**, a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink. * **RoHS Compliant:** Safe for use in lead-free manufacturing processes. --- ### 5. Application Examples This specific heat sink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Server motherboards and storage controllers. 3. **Industrial:** Embedded systems and power supply modules.