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  • ATS-18A-52-C3-R0

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    The **ATS-18A-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ## 1. Technical Specifications Below are the primary technical parameters for this specific part number: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-18A-52-C3-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Pins / Steel Springs) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 1.10 °C/W (at 200 LFM) | --- ## 2. Component Breakdown ### A. Material & Finish * **Aluminum (6063):** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** The blue finish is not just aesthetic; it provides surface protection against corrosion and increases thermal emissivity, which slightly improves heat dissipation through radiation. ### B. The pushPIN™ Attachment System This part uses the proprietary ATS **pushPIN™** system. Instead of using messy thermal adhesives or complex screws, it uses: * **Pre-installed Springs:** Ensures a specific, consistent pressure (load) is applied to the component, optimizing the thermal interface. * **Plastic/Brass Pins:** Secure the heat sink to the PCB via pre-drilled holes. ### C. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates the presence of a **T766 Phase Change Material**. This is a pre-applied thermal pad that melts when the component gets hot, filling microscopic gaps between the chip and the heat sink for maximum heat transfer. --- ## 3. Performance Data (Airflow) The efficiency of this heat sink depends on the velocity of air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (Unducted)** | 2.50 | | **200 (Unducted)** | 1.10 | | **400 (Unducted)** | 0.85 | | **600 (Unducted)** | 0.70 | --- ## 4. Part Number Decoder Understanding the "C3" and "R0" suffixes: * **C3:** Refers to the specific Blue Anodized finish. * **R0:** Indicates the specific version/revision which includes the pre-applied Thermal Interface Material (TIM).
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for this heat sink?
    • ⤷ Can this heat sink be used without a fan (passive cooling)?
    • ⤷ How does the pushPIN system compare to screw-down mounting?