ATS-18A-52-C3-R0
AI

The **ATS-18A-52-C3-R0** is a high-performance electronic thermal management component, specifically a **Pin Fin Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors.
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## 1. Technical Specifications
Below are the primary technical parameters for this specific part number:
| Attribute | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-18A-52-C3-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Brass Pins / Steel Springs) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 1.10 °C/W (at 200 LFM) |
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## 2. Component Breakdown
### A. Material & Finish
* **Aluminum (6063):** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** The blue finish is not just aesthetic; it provides surface protection against corrosion and increases thermal emissivity, which slightly improves heat dissipation through radiation.
### B. The pushPIN™ Attachment System
This part uses the proprietary ATS **pushPIN™** system. Instead of using messy thermal adhesives or complex screws, it uses:
* **Pre-installed Springs:** Ensures a specific, consistent pressure (load) is applied to the component, optimizing the thermal interface.
* **Plastic/Brass Pins:** Secure the heat sink to the PCB via pre-drilled holes.
### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates the presence of a **T766 Phase Change Material**. This is a pre-applied thermal pad that melts when the component gets hot, filling microscopic gaps between the chip and the heat sink for maximum heat transfer.
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## 3. Performance Data (Airflow)
The efficiency of this heat sink depends on the velocity of air moving through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 (Unducted)** | 2.50 |
| **200 (Unducted)** | 1.10 |
| **400 (Unducted)** | 0.85 |
| **600 (Unducted)** | 0.70 |
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## 4. Part Number Decoder
Understanding the "C3" and "R0" suffixes:
* **C3:** Refers to the specific Blue Anodized finish.
* **R0:** Indicates the specific version/revision which includes the pre-applied Thermal Interface Material (TIM).
- ⤷
What is the hole pattern required on the PCB for this heat sink?
- ⤷ Can this heat sink be used without a fan (passive cooling)?
- ⤷ How does the pushPIN system compare to screw-down mounting?