The **ATS-18A-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push Pin | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height (Height Off Base)** | 15mm | --- ### 2. Key Component Features #### A. Fin Design (Cross-Cut) The unit features a **straight fin, cross-cut** pattern. This allows for multi-directional airflow, making it highly effective in environments where the direction of the cooling air is not strictly horizontal or vertical. #### B. Attachment Mechanism (Push Pin) The "Push Pin" system is a mechanical mounting solution that: * Uses a spring-loaded plastic or brass pin to secure the heat sink to the PCB. * Provides consistent pressure (clamping force) on the electronic component to ensure optimal thermal contact. * Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **T766** (a high-performance thermal phase-change material) pre-applied to the base. This eliminates the need for manual application of thermal paste and ensures low thermal resistance between the chip and the aluminum. --- ### 3. Performance Analysis The efficiency of this part depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Speed | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | **100 LFM** | 6.11 °C/W | 16.48 °C/W | | **300 LFM** | 3.33 °C/W | 6.62 °C/W | | **700 LFM** | 2.16 °C/W | 3.20 °C/W | --- ### 4. Typical Applications * **Embedded Systems:** For cooling microprocessors or FPGAs. * **Networking Gear:** Used in routers and switches for high-speed chipsets. * **Power Supplies:** Dissipating heat from power MOSFETs or voltage regulators.