The **ATS-18A-65-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" heat sink series designed for cooling electronic components such as CPUs, GPUs, and power modules. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~1.17 °C/W (at 200 LFM) | | **Fin Pattern** | Straight | --- ### 2. Key Components & Design Features #### A. Heat Sink Geometry The part utilizes a **straight-fin** design. This is optimized for systems where there is a clear, directional airflow (unidirectional). The 25mm height provides a large surface area for heat dissipation without occupying excessive vertical space in a 1U or 2U chassis. #### B. Attachment Mechanism (Push Pin) Instead of adhesive tapes, this model uses a mechanical **Push Pin and Spring** system. This offers several advantages: * **Constant Pressure:** The spring ensures uniform contact between the heat sink and the component, improving thermal transfer. * **Reliability:** It is more resistant to shock and vibration compared to thermal tape. * **Pre-Drilled Holes:** Requires specific hole patterns on the PCB for mounting. #### C. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heat sink comes with **T766 Phase Change Material** or a similar high-performance thermal pad pre-applied to the base. This eliminates the need for manual application of thermal paste. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **18A:** Series identifier. * **65:** Specific footprint/model code. * **C2:** Thermal Interface Material (TIM) type. * **R0:** Revision code / RoHS compliance status. --- ### 4. Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Computing:** Secondary processors or chipsets on motherboards. * **Industrial:** Power supplies and motor controllers requiring robust mechanical mounting.