The **ATS-18A-67-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for securing the cooling element to integrated circuits (ICs) or other heat-generating components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 10mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 20.30°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Airflow Path** | Straight Fin | --- ### 2. Key Electronic Features #### A. Thermal Performance This heat sink is designed for **Passive** or **Active** cooling. The "Straight Fin" design allows air to pass through the channels easily. As the LFM (Linear Feet per Minute) of the airflow increases, the thermal resistance drops significantly (e.g., from ~20°C/W at 100 LFM down to ~4°C/W at 400 LFM), allowing it to dissipate higher wattages. #### B. Mechanical Attachment (Push-Pin) The "18A" designation indicates a specific push-pin configuration. * **Brass Push-Pins:** These provide a secure, vibration-resistant mount to the PCB. * **Spring-Loaded:** The compression springs ensure a consistent and optimized pressure on the chip, which improves heat transfer efficiency by minimizing air gaps. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**. This is a phase-change or high-conductivity material that fills the microscopic imperfections between the chip surface and the heat sink base, ensuring maximum thermal contact. --- ### 3. Part Number Decoding (ATS-18A-67-C2-R0) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **18A** | Attachment style (Push-pin type/size) | | **67** | Series/Profile height identifier | | **C2** | Thermal resistance/Material grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Applications * **Integrated Circuits (ICs):** CPUs, GPUs, and FPGAs. * **Power Electronics:** Voltage regulators and high-speed memory modules. * **Networking:** Routers, switches, and high-bandwidth telecommunications equipment.