Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-18A-69-C2-R0

  • AI
    The **ATS-18A-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ Heat Sink | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance (Flowing)** | 1.15 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.49 °C/W (Unducted) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Pattern** | Cross-Cut (Increases surface area) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features * **pushPIN™ Attachment:** Uses a spring-loaded push-pin mechanism. This ensures consistent pressure across the interface, which is critical for maximizing heat transfer and prevents the heat sink from shifting during vibration. * **Cross-Cut Fin Design:** Unlike straight-line fins, the cross-cut pattern allows for better airflow from multiple directions. This is ideal for systems where the airflow direction is not strictly linear. * **Pre-Applied TIM:** It comes with **T766 thermal grease** already applied to the base, reducing assembly time and ensuring a reliable thermal bond out of the box. * **Blue Anodized Finish:** The surface treatment improves radiation heat transfer and provides corrosion resistance. --- ### 3. Application Use Cases This component is typically used in mid-to-high power electronic assemblies where space is limited but thermal loads are significant: 1. **Embedded Systems:** Cooling processors in industrial computers. 2. **Networking Hardware:** Dissipating heat from ASICs in switches or routers. 3. **Power Electronics:** Managing heat for MOSFET arrays or power converters. --- ### 4. Dimensional Drawing Overview | Dimension | Value | | :--- | :--- | | **Length (A)** | 45 mm | | **Width (B)** | 45 mm | | **Height (C)** | 20 mm | | **Hole Pattern (E/F)** | 38 mm (Pitch between pins) |
    ✨ Follow-up Questions
    • ⤷ How does the push-pin mounting system compare to adhesive-based attachment?
    • ⤷ What is the significance of the 100 LFM airflow rating for thermal resistance?
    • ⤷ Are there alternative heights available for this specific 45x45mm footprint?