ATS-18A-69-C2-R0
AI

The **ATS-18A-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number encodes specific physical and thermal characteristics. Here is the breakdown:
| Parameter | Specification |
| :--- | :--- |
| **Series** | pushPIN™ Heat Sink |
| **Attachment Type** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum (Blue Anodized) |
| **Thermal Resistance (Flowing)** | 1.15 °C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 1.49 °C/W (Unducted) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 20mm |
| **Fin Pattern** | Cross-Cut (Increases surface area) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Features
* **pushPIN™ Attachment:** Uses a spring-loaded push-pin mechanism. This ensures consistent pressure across the interface, which is critical for maximizing heat transfer and prevents the heat sink from shifting during vibration.
* **Cross-Cut Fin Design:** Unlike straight-line fins, the cross-cut pattern allows for better airflow from multiple directions. This is ideal for systems where the airflow direction is not strictly linear.
* **Pre-Applied TIM:** It comes with **T766 thermal grease** already applied to the base, reducing assembly time and ensuring a reliable thermal bond out of the box.
* **Blue Anodized Finish:** The surface treatment improves radiation heat transfer and provides corrosion resistance.
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### 3. Application Use Cases
This component is typically used in mid-to-high power electronic assemblies where space is limited but thermal loads are significant:
1. **Embedded Systems:** Cooling processors in industrial computers.
2. **Networking Hardware:** Dissipating heat from ASICs in switches or routers.
3. **Power Electronics:** Managing heat for MOSFET arrays or power converters.
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### 4. Dimensional Drawing Overview
| Dimension | Value |
| :--- | :--- |
| **Length (A)** | 45 mm |
| **Width (B)** | 45 mm |
| **Height (C)** | 20 mm |
| **Hole Pattern (E/F)** | 38 mm (Pitch between pins) |
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How does the push-pin mounting system compare to adhesive-based attachment?
- ⤷ What is the significance of the 100 LFM airflow rating for thermal resistance?
- ⤷ Are there alternative heights available for this specific 45x45mm footprint?